| Product Name | MF | CAS | Details |
|---|
| Sealing agent | Details |
| Titanium surface conditioner | Details |
| m-xylenediamine | C8H12N2 | Details |
| Amine-105 epoxy resin curing agent | Details |
| Modified epoxy resin curing agent | Details |
| Insulating embedding adhesive | Details |
| CURING AGENT (POLYAMIDE BASE LIQUID) FOR EPOXY RES | Details |
| Modified amine curing agent | Details |
| Resin curing agent | Details |
| Adhesive | Details |
| Curing agent for epoxy resin | Details |
| Lead acetate trihydrate | C4H12O7Pb | 6080-56-4 | Details |
| Xylylenediamine epoxy curing agent | Details |
| Lighting glue | Details |
| Phosphide material | Details |
| Super glue 810 | Details |
| Filter glue | Details |
| Epoxy adhesives | [C11H12O3]n | Details |
| SURFACTANT | C13H27SO3Na；C17H35SO3Na | Details |
| epoxy resin adhesive | Details |
| Metal coating | Details |
| Retard dew paint | Details |
| Polyamide curing agent | Details |
| Foam free surfactant | Details |
| Underwater curing agent | Details |
| Cardanol curing agent | Details |
| T31 epoxy curing agent | Details |
| Feed Mould inhibitor | Details |
| High temperature curing agent | Details |
| Colorless transparent curing agent | Details |
| Industrial repairing adhesive | [C11H12O3]n | Details |
| Toughening curing agent | Details |
| XDA | Details |
| Black electronic potting | Details |
| Zinc phosphorizing liquid,normal temperature | Details |
| Aminals -105 | Details |
| Modified amine epoxy curing agent A50 | Details |
| Anti-corrosion waterproof material | Details |
| Paint coating anti-mold agent BJQ82 | Details |
| Curing agent A60 | Details |
| Leather mold inhibitor BJQ114 | Details |
| Product Total： Product Page： | ||||
| 1 | ||||