Buffered oxide etchant (BOE) 10:1 with surfactant Chemische Eigenschaften,Einsatz,Produktion Methoden

Verwenden

Buffered oxide etchant (BOE) 10:1 with surfactant can be potentially used in the etching of titanium carbide, which is used in the fabrication of microelectromechanical systems (MEMS). It may be used in the etching of spin-on-dopant (SOD) for the development of conductor-insulator-conductor tunneling diodes. It may also be used to enhance the surface of fused quartz devices.

Allgemeine Beschreibung

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

Buffered oxide etchant (BOE) 10:1 with surfactant Upstream-Materialien And Downstream Produkte

Upstream-Materialien

Downstream Produkte

Buffered oxide etchant (BOE) 10:1 with surfactant Anbieter Lieferant Produzent Hersteller Vertrieb H?ndler.

Firmenname	Telefon	E-Mail	Land	Produktkatalog	Edge Rate
Sigma-Aldrich	021-61415566 800-8193336	orderCN@merckgroup.com	China	51456	80
Merck KGaA	(+86) 21 2033 8288	sigmaname@qq.com	CHINA	292362	58

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• Buffered oxide etchant (BOE) 10:1 with surfactant